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 E-BEAM Protocol

• Mount up to 4 wafers to the stage using screws with washers. Use care to not overtighten the screws as this can cause cracks in the wafer
• Set Ti crucible to active using the hearth controller
• Press the big red button to vent the chamber
• Once the pressure reaches atmospheric (~7.6x10² torr), unlatch and open the door
• Mount the stage to the ceiling of the EBEAM E-BEAM evaporation chamber with the center screw
• Check the level of titanium in the crucible. If needed, add more pellets (the crucible should be between 1/2 and 2/3 full). Do not overfill, as this can cause the rotating hearth to jam.
• Vacuum any loose debris from the floor of the chamber, as well as around the Oring O-ring and the door mating surface
• Clean the Oring O-ring with isopropanol and a cleanroom wipe, as well as the door mating surface
• Shut the door and latch shut (~ finger tight)
• Press the big green button to begin venting down the chamber
• Wait 3-5 hours or until the chamber reaches a pressure of ~1.0x10^-6 torr
• Turn on main power switches
• Turn main power key to on
• Wait ~10 seconds for fans and relays to turn on
• Press main power reset, then main power on
• Sweep select on
• Select titanium film on main controller screen
• Press start. The screen should show `ready'
• Press start once more
• Press manual mode
• Open the EGun E-Gun shutter
• Using the hand controller, set power to 3.1-3.3%
• 13.3\%Wait for the titanium to heat. When the evaporation rate passes ~1.0 Å/sec, open the sample shutter and reset the evaporation counter simultaneously
• Deposit 400 400 Å of titanium, keeping the evaporation rate between 1.0-2.0 Å/sec
• Once $\sim$400\r{A} 400 Å of titanium has been deposited, press stop and close the sample shutter simultaneously.
• Close the Egun E-gun shutter
• Turn off the sweep controller
• Main power off, main power key off
• Turn off main power switches
• Press the big red button to vent the chamber
• Once the pressure reaches atmospheric ($\sim$7~7.6x10\textsuperscript{²} torr), unlatch and open the door
• Remove the stage with attached wafers
• Vacuum any loose debris from the floor of the chamber, as well as around the Oring O-ring and the door mating surface
• Clean the Oring O-ring with isopropanol and a cleanroom wipe, as well as the door mating surface
• Shut the door and latch shut ($\sim$finger ~finger tight)
• Press the big green button to begin pressuring down the chamber
• Remove wafers from the stage, and place screws \ & washers in correct storage bin\end{enumerate}